Wearable electronics is going through a path of extreme miniaturization, with main SoCs transitioning to FinFet technology nodes.
Low latency in the next generation ANC algorithms and aggressive power efficiency requirements make power & audio management and mixed signal conversion critical elements in enabling ultra-low power audio playback while minimizing BOM and solution size.
INVENTVM is addressing this clear market trends with a new generation of products and IPs all sampling in 2024 completely redesigned from the ground up.
We claim our platform is the most advanced AMS power management and audio offering best in class performance in all key parameters and supporting next generation technologies such as MEMS speakers.
Audio Offering by Transducer and Market
| Transducer | TWS, OWS, Smart Glasses, XR Headsets | Smartphone/
Tablet |
|---|---|---|
| MEMS Speaker | IVM6311 30Vpp 1nF-200nF load ultra low latency & IQ |
|
| Ceramic Piezo Speaker (surface sound) |
IVM6303 46Vpp 1uF-10uF load |
|
| Haptics Piezo
Thin Film |
IVM6310 160Vpp 1nF-100nF load low IQ |
|
| Electro Magnetic Speaker <100mW |
IVM6312 1.2mW idle power 1.15Vrms <1us latency |
Boosted audio amplifier designed to drive MEMS micro speakers. It features a DC‑DC SIDO (Single inductor dual output) boost converter to supply the output stage bias the MEMS.
It operates from a 3.6V Li–Ion battery and it is compatible with PDM, TDM/I2S audio protocol, moreover its analog input can be driven by most Bluetooth® audio SoC.
With its best in class low power consumption and latency the IVM6311 is the perfect audio amplifier to develop MEMS speakers-based audio products, including true wireless earbuds (TWS), audio glasses, over the counter (OTC) hearing aids and AR/VR glasses.
Paired with our IVM6312 dynamic driver amplifier, it offers the most advanced dual driver reference design on the market.
MEMS micro speaker driver IC
1.8mW idle power
16mm2 solution size
Up to 100nF output load
Up to 30Vpp driving capability and 15V DC bias
TDM, PDM and analog in
Ultra low latency
IVM6311 block diagram
Innovative ultra-low power and ultra-low latency Class-D audio amplifier with digital input addressing the wearable headphone market. At only 1.5mm2, the chip can be placed in the most demanding in ear applications.
Paired with the IVM6311 it enables a very impressive sounding dual driver platform, with all the modern features such platforms now require.
The IVM6312 can drive resistive loads from 4Ω to 32Ω with a voltage up to 1.15Vrms and a DNR of 113dB. The digital input is compatible with TDM/I2S, PDM single bit, dual bit and 4-bit (dual data line). In PDM 4-Bit mode its latency is 500ns.
The IVM63IP offers a low noise modulation scheme that improves the efficiency at any power rate and requires no external inductor/capacitor (LC) output filters. Moreover, the modulation scheme ensures much lower electromagnetic interference (EMI) radiated emissions compared with other Class-D architectures.
With its low power consumption and latency it is the ideal audio amplifier to develop wearable audio products, including true wireless earbuds (TWS), audio glasses, over the counter (OTC) hearing aids, smartwatches and AR/VR glasses.
TWS and hearing aid driver IC
1.2mW idle power
-90dB of THD+N
2.5uVrms floor and <1us latency
TDM, I2S and PDM input
1.5mm2 silicon size
IVM6312 block diagram
High-performance audio amplifier designed to drive capacitive loads such as thin film piezo transducers of up to 100nF. It features a 85V boost converter enabling class-H operation through a 512 level – 170mV step envelop tracking (ET) architecture.
A high-performance digital Class-D amplifier can drive up to 100nF capacitive load with an output voltage up to 160Vpp with advanced anti-pop protection and a Dynamic Range of 115 dB.
The IVM6310 can drive also capacitive haptic transducers leveraging on its fully programmable haptic pattern generator.
Haptic and high voltage audio driver IC
Up to 160Vpp
1S input
TDM/I2S inputInternal haptic waveform generator engine to store on chip complex custom haptic patterns
Integrated touch sensing for the fastest haptic feedback in the industry @ 100us
IVM6310 block diagram
High-performance amplifier designed to drive capacitive loads such as piezo transducers up to 10µF. It features a 25V boost converter enabling class-H operation through a 512 level – 50mV step envelop tracking (ET) architecture.
The boost converter input supply is 10V capable, allowing the IVM6303 to be powered by 1-cell or 2-cell battery systems.
The Class-D amplifier is capable to drive up to 10µF capacitive load with an output voltage up 46Vpp with advanced anti-pop protection and 110 dB DNR. The gain structure of the IVM6303 allows both receiver and speaker modes to make the device suitable in smartphone applications.
The IVM6303 together with piezo transducer enables surface sound increasing the battery life of portable devices including smartphone, tablet, laptop.
Output voltage up to 46Vpp
Capacitive load driving up to 10μF
Dynamic Range 110 dB
1S and 2S input
IVM6303 block diagram
